Institute of Physics of Materials AS CR, v. v. i. > Projects > Thermodynamics and microstructure of environmentally friendly nanoparticle solders

Thermodynamics and microstructure of environmentally friendly nanoparticle solders

Co-investigatorRNDr. Jiří Buršík, CSc., DSc.
Number of Project106/09/0700
AgencyGrantová agentura České republiky
Duration2008-12-31 - 2011-12-30

The project arises from the actual need to replace the Pb-based solders by environmentally friendly materials
using a technology of pastes containing powders of low-melting Pb-free alloys. The materials studied shall be
the nanopowders of pure metals and alloys that are nature friendly and non-toxic (Cu, Ag, Sn, Sn-Zn, Sn-Ni).
We shall study the following structures: substrate/nanopowder/substrate. Interactions of nanoparticles with each other, interactions of nanoparticles with the surrounding atmosphere (gaseous oxygen) and with the
substrate (Cu, Ag, Ni, Sn-Zn, Sn-Ni) shall be studied. An important outcome of the use of metal nanoparticles
is to decrease their melting point in comparison with the corresponding bulk material. We shall investigate this
behaviour by the thermal analysis (DTA and DSC). The oxidation of nanoparticles shall be investigated using
the termogravimetry (DSC/TG). The interactions of nanoparticles with the substrate and the formation of
intermetallic phases shall be analyzed using the analytical electron microscopy. In parallel, we shall use the theoretical methods to predict the equilibrium states (CALPHAD) and diffusion simulation.


Sopoušek J., Buršík J., Zálešák J., Pešina Z.: Silver nanoparticles sintering at low temperature on a copper substrate: in situ characterisation under inert atmosphere and air. J. Mining Metall. B 48 (2012) 63-71

Souček P., Vřešťál J., Zemanová A., Buršík J.: Phase diagram prediction and particle characterization of Sn-Ag nano alloy for low melting point lead-free solders. J. Mining Metall. B 48 (2012) 419-425

Buršík J., Buršíková V., Pešina Z., Sopoušek J.: Mechanical properties and microstructure of model lead-free joints for electronics made with use of nanopowders. Chem. Listy 106 (2012) 390-392


Sopoušek J., Buršík J., Zálešák J., Buršíková V., Brož P.: Interaction of silver nanopowder with copper substrate. Sci. Sintering 43 (2011) 33-38

Buršík J.: Modelling of hardness distribution curves obtained on two-phase materials by grid indentation technique. Chem. Listy 105 (2011) s660-s663

Buršík J., Sopoušek J., Buršíková V., Stýskalík A., Škoda D.: Characterization of sintered Ag nanopowder joints using nanoindentation tests. Chem. Listy 105 (2011) s777-s778