Institute of Physics of Materials AS CR, v. v. i. > Projects > HISOLD - Advanced Solder Materials for High Temperature Application
HISOLD - Advanced Solder Materials for High Temperature Application
| Investigator | RNDr. Aleš Kroupa, CSc. |
| Number of Project | COST MP0602 |
| Agency | European Science Foundation |
| Duration | 2006-12-31 - 2011-12-30 |
Anotace |
| Investigator RNDr. Aleš Kroupa, CSc. is the Chair of Management Committee of the whole project. The focus of the COST Action is the investigation of Pb-free replacements for high-Pb solders for high-temperature applications. This comprises a study of the chemical, physical and mechanical properties of alloys containing a large number of permutations of different alloying elements. A multiscale approach is used: meso-scale: The application of thermodynamics and kinetics to the study of alloying behaviour; the development of materials property databases. macro-scale: The creation of a phenomenological description of corrosion and deformation processes occurring in a solder joint during fabrication and service, micro- (nano-) scale: The investigation by experiment and modelling of the initial stage of the formation of intermetallic phases at the solder/substrate interface. This is efficiently achieved through coordinated international cooperation providing a basis for interdisciplinary research. The action increases the basic understanding of alloys that can be used as Pb-free alternatives to high-temperature solders for practical applications, for example in the aerospace and automotive industries. More details can be found at cost602.ipm.cz |
